Electronic‑Grade Sodium Hypophosphite Monohydrate
Electronic‑Grade Sodium Hypophosphite Monohydrate
Basic Information
CAS No.: 10039‑56‑2Molecular Formula: NaH₂PO₂·H₂O
Electronic‑grade sodium hypophosphite monohydrate is a white crystalline powder with strong reducing property and high hygroscopicity. It is classified as non‑hazardous goods for ocean shipment. Sealed storage in cool and dry environment is required to prevent moisture absorption and caking. Special low‑precipitation inner liner is adopted for packaging to avoid secondary metallic contamination during transportation. Standard package is 25 kg per bag loaded on pallets.
Key Specifications for Electronic Grade
High‑purity and ultra‑low impurity level are the core features differentiating electronic‑grade material from regular industrial grade. Strict control over trace metal and anion impurities avoids bath decomposition, pinhole defects and unstable contact resistance in electronic plating processes.
Assay (NaH₂PO₂·H₂O): 100.0‑101.5%
Sodium phosphite (Na₂HPO₃): max 0.2%
pH value (10% aqueous solution): 6.0‑8.0
Chloride (Cl⁻): max 10 ppm
Sulfate (SO₄²⁻): max 10 ppm
Iron (Fe): max 1 ppm
Calcium (Ca): max 5 ppm
Individual heavy‑metals (Pb, Cd, As, Hg, Cu, Ni): each max 1 ppm
Total heavy‑metals: max 5 ppm
Main Differences between Electronic‑Grade and Industrial‑Grade
Industrial‑grade sodium hypophosphite is suitable for general‑purpose electroless plating for mechanical parts, yet it cannot satisfy high‑end electronic manufacturing requirements due to higher impurity thresholds.For industrial‑grade product, iron content normally ranges from 10‑20 ppm, while chloride and sulfate impurities are allowed at much higher levels. The upper limit of sodium phosphite impurity can reach 0.3‑0.5%. Higher trace‑metal impurities from industrial‑grade material will trigger plating bath decomposition, generate pinholes on coating surface and cause abnormal contact resistance, which will lead to failure of wire‑bonding and soldering performance for electronic components. Besides, electronic‑grade product applies contamination‑preventive inner packaging material, while common industrial‑grade usually uses standard ordinary inner bags without anti‑contamination control.
Main Applications
This product acts as the critical reducing agent for electroless nickel‑plating within electronic manufacturing industry. It is widely used for PCB circuit boards, electronic connectors, semiconductor packaging components and ceramic microelectronic substrates.It enables homogeneous nickel‑phosphorus alloy coating and achieves surface metallization on non‑conductive base materials. The deposited coating provides outstanding corrosion resistance and wear resistance, maintains stable contact resistance, and meets strict requirements for wire‑bonding performance and solderability in high‑end electronic assembly.
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